Pultrusion Resin

Pultrusion Resin — 71/77/78 Series

High-reactivity, low-shrinkage unsaturated polyester resins optimized for the pultrusion process. From fast-line-speed grating production to high-temperature epoxy-modified profiles, these grades deliver excellent glass wet-out, consistent curing, and superior mechanical properties.

Pultrusion 拉挤 Grating 格栅 Cable Tray 电缆桥架 Profiles 型材

Product Overview

Our Pultrusion Resin series provides five specialized grades for continuous fiber-reinforced profile manufacturing. The high-reactivity AT-PUL-02 delivers maximum line speed for standard profiles, while the thixotropic AT-PUL-03 handles complex angled and irregular cross-sections without sagging. The AT-PUL-04 combines medium viscosity with excellent water and weather resistance, ideal for outdoor installations. For surface-critical applications, AT-MAR-03 offers low shrinkage and low wave for premium surface quality. The epoxy-modified AT-PUL-01 provides the ultimate heat resistance with HDT ≥120°C for demanding environments.

Technical Specifications

Grade Viscosity
(mPa·s, 25°C)
Gel Time
(min, 25°C)
Tensile Strength
(MPa, ≥)
Flexural Strength
(MPa, ≥)
HDT
(°C, ≥)
Features
AT-PUL-02 650–900 4–10 65 120 110 高反应活性 / 中等粘度 / 拉挤速度快
AT-PUL-03 800–900 9–10 45 95 85 触变型 / 斜面异型材拉挤 / 低流挂
AT-PUL-04 600–800 10–15 73 108 68 中等粘度 / 高反应活性 / 耐水耐候 / 光泽度高
AT-PUL-01 900–1100 4–10 70 120 120 环氧改性 / 耐热性好 / 机械强度高

* Test conditions: 25°C, standard MEKP promoter. AT-PUL-04 solid content 65-71%. Contact us for full TDS.

Complete Technical Data Sheet (TDS) 完整技术数据
牌号 Acid Value
(mgKOH/g)
Solid Content
(%)
Stability @80°C
80℃稳定性 (h)
Curing System Packaging Storage
AT-PUL-02 18-24 60-66 ≥24 100g树脂 + 1% Co + 2% MEKP HBO-50 220KG金属桶 20℃下6个月,30℃下3个月
AT-PUL-03 18-24 65-72 ≥24 100g树脂 + 1% Co + 2% MEKP HBO-50 220KG金属桶 20℃下6个月,30℃下3个月
AT-PUL-04 16-21 65-71 ≥24 100g树脂 + 1g MEKP + 0.5g 钴水 (25℃) 220KG金属桶 3 months at 25°C
AT-PUL-01 18-24 65-72 ≥24 100g树脂 + 1% Co + 2% MEKP HBO-50 220KG金属桶 20℃下6个月,30℃下3个月

Data tested per GB standards at 23±2°C, 50±5% humidity. Curing conditions may vary by application. Contact us for detailed processing guidance.

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Flagship Applications

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